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| 3.2x1.6mm SMD CHIP LED LAMP APC3216EC HIGH EFFICIENCY RED Features !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Description The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APC3216EC HIGH EFFICIENCY RED(GaAsP/GaP) WATER CLEAR 4 Ty p . 12 V i ew i n g An g l e 21/2 12 0 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength D ev i c e High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA V F=0V;f =1MHz I F =20mA V R = 5V Spectral Line Half-width High Efficiency Red Capacitance Forward Voltage Reverse Current High Efficiency Red High Efficiency Red High Efficiency Red Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. H i g h E f f i c i e n c y R ed 105 30 160 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 High Efficiency Red APC3216EC SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APC3216EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD0995 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/20/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4 |
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